Layanan ebook yang disediakan oleh Perpustakaan Universitas Gunadarma
| Judul: | : | Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging |
|---|---|---|
| ISBN: | : | 9781315305875 |
| Bahasa: | : | Inggris |
| DDC: | : | |
| Kepengarangan: | : | Xing-Chang Wei |
| Edisi: | : | |
| Tempat Terbit: | : | Boca Raton |
| Penerbit: | : | CRC Press, Taylor & Francis Group |
| Tahun Terbit: | : | 2017 |
| Luas Bahan: | : | xviii + 322 hlm. |
| Ilustrasi: | : | |
| Dimensi: | : | |
| Seri: | : | |
| Catatan: | : | |
| Bibliografis: | : | |
| Keyword: | : | Printed circuits, Design and construction, Electronic packaging, Electromagnetic compatibility |